PURPOSE: To obtain a semiconductor device in which the area of a pellet can be reduced by providing a plurality of rows of bonding pads in a partial region along the end side of the pellet, and alternately disposing the protrusions of one row of the pads and the protrusions of the other row in the extending direction of the row.
CONSTITUTION: A predetermined number of second row of bonding pads 15 are formed at the rear of a first row of bonding pads 13. Wedge-shaped protrusions of one row of the bonding pads 13 or 15 are extended between the other rows of the bonding pads 15 or 13. Accordingly, the protrusions of the first and second rows of the pads 13, 15 are alternately disposed along the extending direction of the row. Accordingly, since the first and second rows of the pads 13, 15 are formed substantially in wedge shape at both opposite sides, the first and second rows of the pads 13, 15 can be disposed in a state that they are maintained at a predetermined interval nearer than those of conventional ones.